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Symposium Programme
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Keynote Speeches
Intenationally
recognized speakers, with links to both academic institutions and
industry sectors, will be giving special plenary speechs at the 2012
APEMC Symposium.
1st Speaker
on 22 May 2012 (Opening Session)
| Title: |
Information
Communication Technology (ICT) meets Energy
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| Speaker: |
Dr.
Ingo
Wolff, IEEE Life Fellow, President of the Information Technology
Society (ITG/VDE), Germany, President/CEO of IMST GmbH, Kamp-Lintfort,
Germany
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| Abstract: |
Electrical
power supply systems are changing worldwide. Energy plants on the basis
of fossil fuels and also atomic energy plants, especially in Germany,
more and more are replaced by regenerative green fuel plants like
photovoltaic, wind turbine and biological generators. The increasing
use of local energy producers and their extensively uncontrolled infeed
into the distribution grid demands active manage¬ment of these
facilities. Also, the local infeed into the supply grids can reverse
the flow of energy with voltage band violation that is
detrimen¬tal
to grid quality. All these facts result in dras¬tic increases
in
the complexity of grid control. This also leads to the need for more
active protection and control of components fitted both in the
distributed energy resources and also within the existing grid
infrastructure, to warrant neces¬sary protection and control
functions. As a consequence, greater significance is being attributed
to developing new methods for local, automated grid management in the
distribution grids.
In
future, the increasing number of electric vehicles will also put an
increasing load on the energy dis¬tribution grids, with the
resulting need for charging load management in the grid. Smart grids
will provide an opportunity for both operators of smaller energy
generation systems and energy users to share in the coordination of
offer and supply. All these requirements demand far more
comprehen¬sive metering and monitoring of the energy grid.
Great
significance is attributed to the security requirements that encompass
all the aspects involved in operational safety, security from attack,
and also data protection in terms of privacy.
Energy
information networks and systems have to provide all the data necessary
for metering and controlling the current and future energy grid. The
implementation of an energy information network entails
interdisciplinary deployment of know-how referring to energy supply,
telecommunication and automation technology. Certain parallels can be
detected in the structure and organization of power grids and
tele¬communication networks (including the automation of each).
Various aspects have reached differing levels of evolution, with the
possibility of transferring corresponding experience. This is based on
the assump¬tion of a paradigm shift in the energy supply as
such,
towards a peer-to-peer architecture in order to take account of
increasing local energy production. Know-how transfer between the
various disciplines requires a shared understanding, based for example
on a classification scheme for putting definitions from various domains
in relation to each other.
There
are also a variety of upcoming new problems in the area of
electromagnetic compatibility coming from the need of building new
energy distribution systems and new communication channels as well as
the introduction of electrical vehicles into the electrical power
supply systems.
In
the presentation these upcoming problems, first approaches to solutions
and a view of the future development of this new broad field will be
discussed.
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Dr Ingo Wolff
studied Electrical Engineering at the Technical University Aachen,
Germany. He received his Diplom-Engineer degree (Dipl.-Ing.) in 1964,
his doctoral degree (Dr.-Ing.) in 1967 and his Habilitation degree in
1970, all from the Technical University Aachen. From 1974 to 2003 he
has been a full professor for Electromagnetic Field Theory at the
Duisburg University, Duisburg, Germany. In 1999 to 2003 he has been the
elected president (rector) of the Duisburg University. He was chairman
of the IEEE MTT-S committee 1, Computer Aided Design, from 1992 to 1998
and a member of the IEEE MTT-S committee 15, lectromagnetic Field
Theory, from 1990 to 1998. He is a Life Fellow of the IEEE. In 2002 he
received the IEEE MTT-S Microwave Career Award.
Since
1992 he is (in parallel to his activities at the Duisburg University)
and president (CEO) of IMST GmbH, Kamp-Lintfort, Germany, a privately
held research and development company in wireless and microwave
technologies.
Since
2009 Ingo Wolff is the chairman of the Information Technology Society
(ITG) of the VDE, Germany and a member of the executive committee of
the VDE.
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2nd Speaker
on 22 May 2012 (Opening Session)
| Title: |
Through
Silicon Via(TSV) Design and Measurement for Terabit data-bandwidth of
3D IC
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| Speaker: |
Prof.
Joungho Kim, Department Chair of Electrical Engineering and Computer
Science , Korea Institute of Advanced Science and Technology, Korea
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| Abstract: |
TSV
(Through Silicon Via) based 3D IC technology is emerging as the most
promising next generation IC technology to overcome the technical and
business challenges of the current CMOS process including enlarged
leakage current and considerable increase of investment budget. As a
result, TSV is becoming the most crucial interconnection structure to
determine the performance of the 3D IC. However, in the TSV based 3D
IC, signal integrity issues of the TSV are becoming the major design
concern due to the high frequency loss, power supply noise, and noise
coupling of the TSV, while more than thousand of TSV’s as
well as vertical and lateral interconnections are routed in a tiny 3D
silicon space.
In
this presentation, I will introduce the modeling efforts and
measurement results of the TSV with respect to high frequency loss,
power supply noise, and noise coupling in the 3D IC. In addition, I
will present high frequency modeling and measurement results to show
the silicon depletion effect, failure mechanism, and thermal impacts on
the performance of TSV. Finally, I will propose future TSV structures
for over 10 tera-bit scale data-bandwidth for CPU-memory interface in
3D IC.
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Prof.
Joungho Kim received B.S. and M.S. degrees in electrical engineering
from Seoul National University, Seoul, Korea, in 1984 and 1986,
respectively, and Ph.D degree in electrical engineering from the
University of Michigan, Ann Arbor, in 1993. In 1994, he joined Memory
Division of Samsung Electronics, where he was engaged in Gbit-scale
DRAM design.
In
1996, he moved to KAIST (Korea Advanced Institute of Science and
Technology). He is currently EECS Department Chair at KAIST. Since
joining KAIST, his research centers on EMC modeling, design, and
measurement methodologies of 3D IC, System-in-Package(SiP), multi-layer
PCB, and wireless power transfer technology. Especially, his major
research topic is focused on chip-package co-design and simulation for
signal integrity, power integrity, ground integrity, timing integrity,
and radiated emission of 3D IC and SiP. He has successfully
demonstrated low noise and high performance designs of numerous
SiP’s for wireless communication applications such as ZigBee,
T-DMB, NFC, and UWB. He was on a sabbatical leave during an academic
year from 2001 to 2002 at Silicon Image Inc., Sunnyvale CA. He was
responsible for low noise package designs for SATA, FC, HDMI, and Panel
Link SerDes devices. Recently, he started a new research on wireless
power transfer technology using magnetic field resonance. He has been
one of the co-leaders in a national project, OLEV (Online Electrical
Vehicle), for EMI and EMF reduction design. The OLEV was selected as
one of the 50 Best Inventions in 2010 by Times Magazine. Recently, he
became center director of 3DIC-RC (3D IC Research Center) supported by
Hyniz Inc., and SAE-RC (Smart Automotive Electronics Research Center)
supported by KET Inc.
He
has authored and co-authored over 370 technical papers published at
refereed journals and conference proceedings in modeling, design, and
measurement of 3D IC, SiP, PCB, and wireless power transfer. Also, he
has given more than 174 invited talks and tutorials at the academia and
the related industries. He received Outstanding Academic Achievement
Faculty Award of KAIST in 2006, Best Faculty Research Award of KAIST in
2008, National 100 Best Project Award in 2009, and KAIST International
Collaboration Award in 2010, respectively. Dr. Joungho Kim was the
symposium chair of IEEE EDAPS 2008 Symposium, and is the TPC chair of
APEMC 2011. He is appointed as an IEEE EMC society distinguished
lecturer in a period from 2009-2011. He received Technology Achievement
Award from IEEE Electromagnetic Society in 2010. Currently, he is TPC
member of EPEPS (Electrical Performance of Electronic Packaging and
System). He is also an associated editor of the IEEE Transactions of
Electromagnetic Compatibility. He served as a guest editor of the
special issue in the IEEE Transactions of Electromagnetic Compatibility
for PCB level signal integrity, power integrity, and EMI/EMC in 2010,
and also as a guest editor of the special issue in the IEEE
Transactions of Advanced Packaging for TSV (Through-Silicon-Via) in
2011.
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2nd Speaker
on 23 May 2012 (Plenary Session)
| Title: |
Towards
greener, smarter and more sustainable Eletronic Devices and Networks
utilizing Nanotechnology
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| Speaker: |
Prof.
Manos M. TENTZERIS, IEEE Fellow, Georgia Institute of Technology, USA
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| Abstract: |
Nanotechnology
and Inkjet-printed flexible electronics and sensors fabricated on paper
, plastic and other polymer substrates are introduced as a sustainable
ultra-low-cost solution for the first paradigms of Internet of Things,
"Smart Skins" and "Zero-Power" applications. The talk will cover
examples from UHF up to the millimeter-wave frequency ranges (mmID's),
while it willl include the state of the art of fully-integrated
wireless sensor modules on paper or flexible polymers and show the
first ever 2D sensor integration with an RFID tag module on paper, as
well as numerous 3D multilayer paper-based and LCP-based RF/microwave
structures, that could potentially set the foundation for the truly
convergent wireless sensor ad-hoc networks of the future with enhanced
cognitive intelligence and "zero-power" operability through ambient
energy harvesting. Examples from wearable (e.g. biomonitoring) antennas
and RF modules will be reported, as well as the first integration of
inkjet-printed nanotechnology-based sensors on paper and organic
substrates. The talk will also present challenges for inkjet-printed
high-complexity modules as well as future directions in the area of
environmentally-friendly ("green") RF electronics and "smart-house"
conformal sensors.
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Professor Manos M. Tentzeris
is a Fellow of IEEE, a Professor with School of Electrical and Computer
Engineering, Georgia Institute of Technology, USA. He received the
Diploma Degree in Electrical and Computer Engineering from the National
Technical University of Athens ("Magna Cum Laude") in Greece and the
M.S. and Ph.D. degrees in Electrical Engineering and Computer Science
from the University of Michigan, Ann Arbor, MI. He has published more
than 420 papers in refereed Journals and Conference Proceedings, 5
books and 19 book chapters. Dr. Tentzeris has helped develop academic
programs in Highly Integrated/Multilayer Packaging for RF and Wireless
Applications using ceramic and organic flexible materials, paper-based
RFID's and sensors, biosensors, wearable electronics, inkjet-printed
electronics, "Green" electronics and power scavenging, nanotechnology
applications in RF, Microwave MEM's, SOP-integrated (UWB, multiband,
mmW, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD,
MultiResolution Algorithms) and heads the ATHENA research group (20
researchers). He is currently the Head of the GT-ECE Electromagnetics
Technical Interest Group and he has served as the Georgia Electronic
Design Center Associate Director for RFID/Sensors research from
2006-2010 and as the Georgia Tech NSF-Packaging Research Center
Associate Director for RF Research and the RF Alliance Leader from
2003-2006. He was the recipient/co-recipient of the 2010 IEEE Antennas
and Propagation Society Piergiorgio L. E. Uslenghi Letters Prize Paper
Award, the 2011 International Workshop on Structural Health Monitoring
Best Student Paper Award,the 2010 Georgia Tech Senior Faculty
Outstanding Undergraduate Research Mentor Award, the 2009 IEEE
Transactions on Components and Packaging Technologies Best Paper Award,
the 2009 E.T.S.Walton Award from the Irish Science Foundation, the 2007
IEEE APS Symposium Best Student Paper Award, the 2007 IEEE IMS Third
Best Student Paper Award, the 2007 ISAP 2007 Poster Presentation Award,
the 2006 IEEE MTT Outstanding Young Engineer Award, the 2006
Asia-Pacific Microwave Conference Award, the 2004 IEEE Transactions on
Advanced Packaging Commendable Paper Award, the 2003 NASA Godfrey "Art"
Anzic Collaborative Distinguished Publication Award, the 2003 IBC
nternational Educator of the Year Award, the 2003 IEEE CPMT Outstanding
Young Engineer Award, the 2002 International Conference on Microwave
and Millimeter-Wave Technology Best Paper Award (Beijing, CHINA), the
2002 Georgia Tech-ECE Outstanding Junior Faculty Award, the 2001 ACES
Conference Best Paper Award and the 2000 NSF CAREER Award and the 1997
Best Paper Award of the International Hybrid Microelectronics and
Packaging Society. He was the TPC Chair for IEEE IMS 2008 Symposium and
the Chair of the 2005 IEEE CEM-TD Workshop and he is the Vice-Chair of
the RF Technical Committee (TC16) of the IEEE CPMT Society. He is the
founder and chair of the RFID Technical Committee (TC24) of the IEEE
MTT Society and the Secretary/Treasurer of the IEEE C-RFID. He is the
Associate Editor of IEEE Transactions on Microwave Theory and
Techniques, IEEE Transactions on Advanced Packaging and International
Journal on Antennas and Propagation. He has given more than 100 invited
talks to various universities and companies all over the world. He is a
Fellow of IEEE, a member of URSI-Commission D, a member of MTT-15
committee, an Associate Member of EuMA, a Fellow of the Electromagnetic
Academy and a member of the Technical Chamber of Greece. Prof.
Tentzeris is one of the IEEE MTT-S Distinguished Microwave Lecturers
from 2010-2012.
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